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Size, weight, power, and cost reduction are required by many RF applications as they allow for more efficient, deployable solutions. Integra can produce metal waveguides and rectaxial transmission lines embedded inside of electronic substrates. We can now combine the high density, small footprint of micro-strip substrates with the high performance of metal waveguide structures.
INTEGRATED MM-WAVE ROUTING
Integra Devices offers air-filled, hollow waveguides inside conventional electronic substrates as well as dielectric-filled, rectaxial transmission lines to route mm-wave signals. Now, high density, low-loss circuits can be formed at a much smaller footprint than bulky, machined waveguide systems. MMIC's can also be mounted on top of the electronic substrate, minimizing loss and optimizing integration of the system.
Integra's Amalga™ technology can fabricate floating micro-structures inside of waveguides. This allows one to design functions such as diplexers, filters, couplers, attenuators, and dividers. Each micro-component can be stand-alone component or integrated inside the overall mm-wave system.
5G? NO PROBLEM
The Internet of Things is looking to connect more than 30 billion devices to the internet. Our current communications infrastructure will not be able to support this level of connection.
The next generation of telecommunications, 5G, aims to match the demands of IoT by taking place in mm-wave frequency bandwidths (28 GHz and above) and high distribution of backhaul small-cells through our infrastructure. However, current mm-wave components (large, bulky, costly) make it difficult for small-cell backhaul modules to be scalable, cost-effective, and practical. Integra Device’s manufacturing technology resolves this challenge, through the batch-production of miniature, low-cost mm-wave components, substrates, and antennas.