© 2018 Integra Devices

INNOVATION

A NEW PARADIGM IN MICRO-DEVICE MANUFACTURING 

For years, the de facto standard for making very small structures has been the use of silicon-based processes, leveraging the successes of semiconductor manufacturing. However, while this technology is excellent for building microcircuits, it has serious limitations for building complex 3D mechanical products. As a result, semiconductor-based MEMS manufacturing  has only been able to miniaturize less than 8% of the over $200 Billion industrial components market. Despite extensive MEMs-based effort, many components such as sensors, energy harvesters, and microwave devices are still large, bulky, and costly solutions. Integra Devices leverages a groundbreaking new paradigm to build micro-devices, created from over 15 years of research and over $20 million in funding at the University of California, Irvine.

Amalga™ leverages 3D heterogeneous integration technology practiced in the microelectronics packaging industry, using lamination strategies to build-up complex 3D structures. Different layers of materials (e.g. films, foils) are processed and bonded together to produce a final panel of structures. This allows a wide variety of manufacturing processes and materials to be included, and individual panel fabrication can be outsourced to manufacturers with optimized processes for those layers.

OUR ENGINE - INTRODUCING AMALGA

GREATER MATERIAL SELECTION

COMPLETE INTEGRATION

•   Structural materials

•   Biocompatible materials

•   Optical materials

•   Electronic materials

•   Specialty materials

•   Thin-films processing

•   Micro assembly

•   Machining

•   Laser forming

•   Electroforming

•   Embossing

•   Injection molding

•   Lithography

•   Lamination

•   Bonding

ALREADY PACKAGED

FABLESS, BATCH MANUFACTURING

A CANDY SHOP OF UNPRECEDENTED MICRO-DEVICES